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Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA

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Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA Detail:

Characteristics and application scope of composite flexible packaging materials

The so-called composite flexible packaging, is to use more than two different properties The composite material formed by flexible packaging material, composition can give full play to each New high performance packaging with component material advantages.

Plastic flexible packaging is Refers to the composite packaging of plastic film. It can combine the advantages of each layer of film To overcome their disadvantages and combine to obtain a more desirable package Loading materials, can meet the requirements of a variety of products.

The most important characteristic of composite materials is that the composite material has excellent characteristics On the properties of the individual materials that make up the composite. The composite Packaging materials, it is in the micro structure to follow the knot Together, give play to the advantages of the composition of the substance, expand the scope of use, to High economic efficiency makes it a more practical and complete package Packing materials, the use of its excellent comprehensive performance, in order to achieve commodity package Requirements for loading.

The performance of composite packaging material is good or bad and the glue used when composite Adhesives, the choice of adhesives must consider its adhesion, Medium resistance, heat resistance, hygiene, etc. Therefore, a good Composite packaging materials can not be separated from high quality adhesive

This model improves the performance of inner layer, bringing low friction. If the bag making machine has high speed, this model will help. 

Used in laminating of various treated film like OPP, CPP, PA, PET, PE, Al etc.
This product well solves the friction problem of PE and CPP, make inner layer more smooth, which is good for bag making machine with high speed.

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Short curing time
Low coating weight
Well solve friction coefficient of PE and CPP
Long pot life≥30 min
High lamination speed can achieve 450m/min
Density(g/cm3)
A: 1.19±0.01
B: 1.14±0.01
Payment: T/T or L/C


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Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA detail pictures


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Our eternal pursuits are the attitude of regard the market, regard the custom, regard the science plus the theory of quality the basic, have faith in the main and management the advanced for Low MOQ for Glue For Shoe Soles - WD8117A/B Two-Component Solventless Laminating Adhesive For Flexible Packaging – KANGDA , The product will supply to all over the world, such as: Luxembourg, Finland, Swiss, We have advanced production technology, and pursuit innovative in goods. At the same time, the good service has enhanced the good reputation. We believe that as long as you understand our product, you need to be willing to become partners with us. Looking forward to your inquiry.
  • The company leader recept us warmly, through a meticulous and thorough discussion, we signed a purchase order. Hope to cooperate smoothly
    5 Stars By Lena from panama - 2018.12.30 10:21
    The company can think what our think, the urgency of urgency to act in the interests of our position, can be said this is a responsible company, we had a happy cooperation!
    5 Stars By Kay from Portugal - 2018.11.04 10:32
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